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MC10H350 PECL* to TTL Translator
(+5 Vdc Power Supply Only)
Description
The MC10H350 is a member of the 10H family of high performance ECL logic. It consists of 4 translators with differential inputs and TTL outputs. The 3-state outputs can be disabled by applying a HIGH TTL logic level on the common OE input. The MC10H350 is designed to be used primarily in systems incorporating both ECL and TTL logic operating off a common power supply. The separate VCC power pins are not connected internally and thus isolate the noisy TTL VCC runs from the relatively quiet ECL VCC runs on the printed circuit board. The differential inputs allow the MC10H350 to be used as an inverting or noninverting translator, or a differential line receiver. The MC10H350 can also drive CMOS with the addition of a pullup resistor.
Features
http://onsemi.com MARKING DIAGRAMS*
16 MC10H350L AWLYYWW CDIP-16 L SUFFIX CASE 620A 1
* Propagation Delay, 3.5 ns Typical * MECL 10KTM Compatible * Pb-Free Packages are Available*
16 16 1 PDIP-16 P SUFFIX CASE 648 1 MC10H350P AWLYYWWG
10H350 ALYWG
SOEIAJ-16 CASE 966 1 20
20 1 PLLC-20 FN SUFFIX CASE 775 A WL, L YY, Y WW, W G
10H350G AWLYYWW
= Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
*For additional marking information, refer to Application Note AND8002/D. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2006
February, 2006 - Rev. 8
1
Publication Order Number: MC10H350/D
MC10H350
9 3 4 5 6 11 12 13 14 VCC (+5.0 VDC) = PINS 1 AND 16 GND = PIN 8 ECL VCC AOUT AIN AIN BIN BIN BOUT GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 TTL VCC COUT CIN CIN DIN DIN DOUT OE
2
7
10
15
Pin assignment is for Dual-in-Line Package.
Figure 1. Logic Diagram
Figure 2. Dip Pin Assignment
Table 1. MAXIMUM RATINGS
Symbol VCC TA Tstg Power Supply (VEE = GND) Operating Temperature Range Storage Temperature Range - Plastic - Ceramic Characteristic Rating 7.0 0 to +75 -55 to +150 -55 to +165 Unit Vdc C C C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
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MC10H350
Table 2. ELECTRICAL CHARACTERISTICS (VCC = 5.0 V 5%) (Note 1)
TA = 0C to 75C Symbol ICC IIH IINH IIL IINL VIH VIL VDIFF VCM VOH VOL IOS IOZH IOZL Power Supply Current Input Current High Input Current Low Input Voltage High Input Voltage Low Differential Input Voltage (Note 1) Pins 3-6, 11-14 (1) Voltage Common Mode Pins 3-6, 11-14 Output Voltage High IOH = 3.0 mA Output Voltage Low IOL = 20 mA Short Circuit Current VOUT = 0 V Output Disable Current High VOUT = 2.7 V Output Disable Current Low VOUT = 0.5 V Characteristic TTL ECL Pin 9 Others Pin 9 Others Pin 9 Pin 9 Min - - - - - - 2.0 - 350 2.8 2.7 - -60 - - Max 20 12 20 50 -0.6 50 - 0.8 - VCC - 0.5 -150 50 -50 Unit mA mA mA mA Vdc Vdc mV Vdc Vdc Vdc mA mA mA
*Positive Emitter Coupled Logic 1. Common mode input voltage to pins 3-4, 5-6, 11-12, 13-14 must be between the values of 2.8 V and 5.0 V. This common mode input voltage range includes the differential input swing. 2. For single-ended use, apply 3.75 V (VBB) to either input depending on output polarity required. Signal level range to other input is 3.3 V to 4.2 V. 3. Any unused gates should have the inverting inputs tied to VCC and the noninverting inputs tied to ground to prevent output glitching.
Table 3. AC PARAMETERS (CL = 50 pF) (VCC = 5.0 5%) (TA = 0C to 75C)
TA = 0C to 75C Symbol tpd tr tf tpdLZ tpdHZ tpdZL tpdZH Characteristic Propagation Delay Data (50% to 1.5 V) Rise Time (Note 4) Fall Time (Note 4) Output Disable Time Output Enable Time Min 1.5 0.3 0.3 2.0 2.0 2.0 2.0 Max 5.0 1.6 1.6 6.0 6.0 8.0 8.0 Unit ns ns ns ns ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. 1.0 V to 2.0 V w/50 pF into 500 W.
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MC10H350
3-STATE OUTPUT LOW ENABLE AND DISABLE TIMES 1.5 V TPZL VOUT 1.5 V TPLZ 3-STATE OUTPUT HIGH ENABLE AND DISABLE TIMES 1.5 V TPZH 1.5 V 1.5 V TPHZ Q VOH 3.5 V
OE
OE
1.5 V VOL 0.3 V
VOUT
0.3 V
Figure 3. 3-State Switching Waveforms
+7.0 V OPEN
TPZL, TPLZ, O, C,
ALL OTHER
500 W D.U.T . 50 PF 500 W
*INCLUDES JIG AND PROBE CAPACITANCE Application Note: Pin 9 is an OE and the MC10H350 is disabled when OE is at VIH or higher.
Figure 4. Test Load
ORDERING INFORMATION
Device MC10H350FN MC10H350FNG MC10H350FNR2 MC10H350FNR2G MC10H350L MC10H350M MC10H350MG MC10H350MEL MC10H350MELG MC10H350P MC10H350PG Package PLLC-20 PLLC-20 (Pb-Free) PLLC-20 PLLC-20 (Pb-Free) CDIP-16 SOEIAJ-16 SOEIAJ-16 (Pb-Free) SOEIAJ-16 SOEIAJ-16 (Pb-Free) PDIP-16 PDIP-16 (Pb-Free) Shipping 46 Units / Rail 46 Units / Rail 500 / Tape & Reel 500 / Tape & Reel 25 Unit / Rail 50 Unit / Rail 50 Unit / Rail 2000 / Tape & Reel 2000 / Tape & Reel 25 Unit / Rail 25 Unit / Rail
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MC10H350
PACKAGE DIMENSIONS
20 LEAD PLLC CASE 775-02 ISSUE E
B -N- Y BRK D -L- -M- W D V 0.010 (0.250) T L-M N Z 0.007 (0.180) M T L-M U
S
N
S S
0.007 (0.180) M T L-M
N
S
20
1
X VIEW D-D
G1
S
S
S
A Z R
0.007 (0.180) M T L-M 0.007 (0.180) M T L-M
S
N N
S
S
S
H K1
0.007 (0.180) M T L-M
S
N
S
C
E G G1 0.010 (0.250) S T L-M 0.004 (0.100) J -T- VIEW S
S SEATING PLANE
K F VIEW S 0.007 (0.180) M T L-M
S
N
S
N
S
NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 ---
MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 ---
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MC10H350
PACKAGE DIMENSIONS
SOEIAJ-16 CASE 966-01 ISSUE A
16
9
LE Q1 E HE M_ L DETAIL P
1
8
Z
D A VIEW P c
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.78 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.031
e
b 0.13 (0.005)
M
A1 0.10 (0.004)
CDIP-16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A-01 ISSUE O
B
16
A
9
A
M L
B
1 8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620-10. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 --- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01
16X
J
E F C K T N G
16X
0.25 (0.010)
M
TB
SEATING PLANE
D
0.25 (0.010)
M
TA
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MC10H350
PACKAGE DIMENSIONS
PDIP-16 P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R
9
-A-
16
B
1 8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
F S
C
L
-T- H K G D
16 PL
SEATING PLANE
J TA
M
M
0.25 (0.010)
M
MECL 10K is a trademark of Motorola, Inc.
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MC10H350/D

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